導電銀漿

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    導電銀漿

    ☑ Product Specifications
    Conductive inks can be categorized into two major types based on the type of resin used: solvent-based conductive inks and water-based (hydrophilic) conductive inks.

    Solvent-based conductive inks are formulated by dispersing conductive particles within organic solvents. In contrast, water-based conductive inks utilize aqueous resins and a small amount of hydrophilic solvents to adjust printability before the addition of conductive particles. Because water-based conductive inks are composed of aqueous resins and contain significantly fewer volatile organic compounds (VOCs) than solvent-based versions, they pose a much lower risk to human health and the environment. As such, they are classified as environmentally friendly products.

    Furthermore, based on the type of conductive particles used, these inks can be classified into three categories: silver paste (silver ink), carbon paste (carbon ink), and silver-carbon paste (silver-carbon ink).




    P/N
    Appearance / Color
    Sheet Resistance
    （mΩ/□/mil）
    Pencil Hardness
    Adhesion
    Solid Content
    (wt%)
    Viscosity
    (cps @25℃)
    Curing Conditions
    (Oven)
    Suggested Applications
    Datasheet




                　　Solvent-Based Silver Paste（Halogen-Free）                                


    GA-701B
    Silver Grey
    ≦30
    2H
    4B
    ~78.5
    105,000±15,000
    130℃/30min
    Touch Screen - Screen Printing Silver Paste, Fine Line Circuitry
    規格書下載點


    GA-6402E
    Silver Yellow
    ≦40
    F
    4B
    ~79
    30,000±6,000
    140℃/60min
    Touch Screen / Flexible Printed Circuit (FPC)
    規格書下載點


    GA-6402F
    Silver Yellow
    ≦40
    H
    4B
    ~78
    60,000±10,000
    130℃/30min

    Membrane Switch - Stretchable Silver Paste
    規格書下載點


    GA-668E
    Silver Black
    ≦13
    F
    4B
    ~78
    60,000±10,000
    130℃/30min
    Touch Screen - Low Temperature Curing (85℃/40min，Resistance<15）
    規格書下載點


    GA6401#5D1A+
    Silver Yellow
    ≦25
    2H
    4B
    ~76
    53,000±8,000
    130℃/30min
    Touch Screen - Laser Silver Paste (LSP)
    規格書下載點


    GA-6405F
    Silver Grey
    ≦40
    2H
    4B
    ~72
    40,000±5,000
    130℃/30min
    Touch Screen - Laser Silver Paste (LSP)
    規格書下載點


    GA-6405E++
    Silver Grey
    ≦55
    2H
    4B
    ~75
    43,000±7,000
    130℃/30min
    Touch Screen - Laser Silver Paste (LSP)
    規格書下載點


    GA-6407B
    Silver Grey
    ≦35
    2H
    4B
    ~75
    59,000±3,000
    130℃/30min
    Touch Screen - Capacitive
    規格書下載點


    PAX-560
    Silver Grey
    ≦25
    H
    4B
    ~71
    40,000±8,000
    130℃/30min
    Touch Screen -   Resistive
    規格書下載點


    PAX-807D
    Silver Grey
    ≦35
    2H
    4B
    ~73
    55,000±10,000
    130℃/30min
    Touch Screen - Laser Silver Paste (LSP), Fine Line Circuitry
    規格書下載點


    PAX-808
    Silver Grey
    ≦20
    2H
    4B
    ~81
    245,000±15,000
    130℃/30min
    Touch Screen - Laser Silver Paste (LSP), Fine Line Circuitry
    規格書下載點


    PA-591
    Silver
    ≦20
    2H
    100/100
    ~70
    16,000±3,000
    120℃/30min
    Touch Screen - Excellent Adhesion on Etched Surfaces
    規格書下載點


    KA-210
    Silver Yellow
    ≦16
    2H
    100/100
    ~64
    36,000±6,000
    130℃/30min
    Flexible Printed Circuit (FPC) Applications
    規格書下載點


    KAX-810-5#7E
    Silver
    ≦15
    2H
    4B
    ~78
    35,000±6,000
    150℃/30min
    Flexible Electronics (PET/TPU) - High Flexibility / Bendability
    規格書下載點


    KAX-810-5#9E
    Silver
    ≦20
    2H
    4B
    ~78
    38,000±3,000
    150℃/30min
    Smart Textiles (Fabric/TPU) - High Flexibility
    規格書下載點


    KAX-810-10
    Silver
    ≦35
    H
    4B
    ~60
    15,000±3,000
    150℃/30min
    Smart Textiles (Fabric/TPU) - High Flexibility
    規格書下載點


    GA-2038
    Silver
    ≦16
    2H
    100/100
    ~71
    25,000±5,000
    120℃/30min
    RFID Tags / Inlay Applications
    規格書下載點


    GA-2048
    Silver
    ≦14
    2H
    100/100
    78
    35,000±5,000
    120℃/30min
    RFID Tags / Inlay Applications
    規格書下載點


    SA-513
    Silver Yellow
    ≦14
    2H
    100/100
    ~75.4
    32,000±8,000
    60℃/30min
    Excellent Conductivity & Low-Temperature Curing
    規格書下載點


    SA-516
    Silver Grey
    ≦198
    2H
    100/100
    ~53
    14,000±3,000
    130℃/30 min
    Conductive Silver Paste - Low Silver Content Requirement
    規格書下載點


    SA516
    銀灰
    ≦198
    2H
    100/100
    ~53
    14,000±3,000
    130℃/30 min
    導電銀漿、低銀含量需求



    P/N
    Appearance / Color
    Sheet Resistance
    （mΩ/□/mil）
    推力
    耐焊錫性
    Solid Content
    (wt%)
    Viscosity
    (cps @25℃)
    Curing Conditions
    (Oven)
    Suggested Applications
    Datasheet


    SV-190-1
    Silver Grey
    ≦3
    ≥10 kgf
    > 95%
    ~83
    175,000±15,000
    850℃/10 min
    Passive Components - Ceramic Substrate Applications
    規格書下載點


    SV-190-2
    Silver Grey
    ≦5
    -
    > 95%
    ~60
    175,000±15,000
    850℃/10 min
    Passive Components - Ceramic Substrate Applications
    規格書下載點


    SV-190-6
    Silver Grey
    ≦3
    ≥10 kgf
    > 95%
    ~86
    200,000±15,000
    850℃/10 min
    Passive Components - Ceramic Substrate Applications
    規格書下載點


    SV-486A
    Silver Grey
    ≦5
    -
    > 90%
    ~81
    115,000±15,000
    500℃/10 min
    Mid-to-High Temp Touch Components - High-Temperature Glass & Ceramic Substrate
    規格書下載點


    GA-6406
    銀灰
    ≦30
    2H